Ho paka
Re fana ka boleng bo holimo ka ho fetisisa, ba pakiloeng ka theko e phahameng ka ho fetisisa ea moruo e fumanehang. Ka ponaletso ea leseli ea 40%, e iponahatsa e le pontšo ea li-IC's (li-circuits tse kopaneng) le li-PCB (li-boardcircuit board). Ts'ireletso ea tšepe e tšoarellang ho feta e patiloeng e fa FaradayCage ts'ebetso e hlokahalang ho sirelletsa likonteraka tsena khahlano le li-tuli.
Lihlahisoa tsohle li tla paka ka anti-tuli. Tsamaisa ka ts'ireletso ea antistatic ea ESD.
Ntle le tse fumanehang ka har'a lipakatso tsa ESD li tla sebelisa leseli la rona: Karolo ea Motsoako, Brand le Boholo.
Re tla hlahloba thepa eohle pele re tsamaisoa, re netefatsa hore lihlahisoa tsohle li maemong a matle mme re netefatse hore likarolo ke litheolelo tse ncha tsaalmalmatch.
Kamora hore thepa eohle e netefatse hore ha e na mathata ka mor'a ho paka, re tla e paka ka mokhoa o sireletsehileng mme ra romella ka polelo ea lefats'e. E bontša ho phunya le ho hanyetsa likhapha hammoho le botšepehi bo tiileng ba tiiso.
Re ka fana ka ts'ebeletso ea ho fana ka litšebeletso lefatšeng ka bophara, joalo ka DHLor FedEx kapa TNT kapa UPS kapa e mong ea fetisang thepa pele.
Tsamaiso ea Lefatše ka bophara ke DHL / FedEx / TNT / UPS
Litefiso tsa Shipping DHL / FedEx
1). O ka fana ka akhaonto ea hau ea tlhahiso ea thepa bakeng sa ho romelloa, haeba u se na ak'haonte efe kapa efe ea ho romella thepa, re ka fana ka tlaleho ea inadvance ea rona.
2). Sebelisa ak'haonte ea rona bakeng sa ho romella thepa, Tefo ea Thomello (Reference DHL / FedEx, linaha tse fapaneng li na le theko e fapaneng.)
| Litefiso tsa thomello :: |
(Reference DHL le FedEX) |
| Boima (KG): 0.00kg-1.00kg |
Theko (USD $): USD $ 60.00 |
| Boima (KG): 1.00kg-2.00kg |
Theko (USD $): USD $ 80.00 |
* Theko ea litšenyehelo e bontšoa ho DHL / FedEx. Lintlha tse qotsitsoeng, ka kopo ikopanye le rona. Naha e fapaneng liqoso tse hlahisitsoeng ke tse fapaneng.
- Tsela e 'Ngoe ea ho Romela: SF Express bakeng sa Asia; Ching-woo e khethehileng ea moea bakeng sa Korea, linaha tsa Aramexfor Middle East. Tsela e 'ngoe ea ho romella, ka kopo ikopanye le rona.
Re ka boela ra romella thepa ho motho ea e romelang ka pele kapa ho motho e mong eo u mo romellang eona, e le hore u ka romella thepa eo hammoho. E kanna ea u bolokela thepa, kapa ea u nolofalletsa.
- Lintlha tsa Tsamaiso: Shippinginformation, Re hloka tlhaiso-leseling e kenyelletsoang ho kenyelletsa Lebitso la K'hamphani ea Receiver (Kapa ea motho), Lebitso la kamohelo, Nomoro ea ho ikopanya, Aterese le Zip Code. Ka kopo netefatsa tlhahisoleseling ena, e le hore re ka hlophisa thomello kapele.
- Nako ea thomello: Nako ea ho tsamaisa e tla hloka 2-5days ho boholo ba naha lefats'e ka bophara bakeng sa DHL / UPS / FEDEX / TNT.
FSBB20CH60A Lintlha tsa sehlahisoa:
Title: FSBB20CH60A IGBT Module: Main Features, Parameters, and Application Scenarios
As the product name suggests, the FSBB20CH60A is an IGBT (Insulated Gate Bipolar Transistor) module that falls under the category of Discrete Semiconductor Products. It boasts various features that make it an ideal choice for several application scenarios.
Main Features:
The FSBB20CH60A is a 600V IGBT module with a built-in driver. It has a compact size and high efficiency. The module is designed to operate at high power levels and high switching frequency, ensuring maximum output with minimum losses. Additionally, it has short-circuit protection, over-current protection, and under-voltage protection.
Performance Parameters:
The FSBB20CH60A has an output voltage of 600V, a current rating of 20A, and a power rating of 300W. Its accuracy and efficiency are remarkable, with an excellent temperature range of -40°C to 150°C.
Application Scenarios:
The FSBB20CH60A IGBT module is highly versatile, making it suitable for several application scenarios. For instance, it can be used in various electronic devices such as power supplies, motor drives, AC/DC converters, and inverters. It is also commonly used in the automotive industry, renewable energy generation, industrial automation, medical equipment, and consumer electronics.
Integrated Circuits:
The FSBB20CH60A IGBT module is an example of a mixed-signal integrated circuit, combining both analog and digital circuits. It is a complex semiconductor device that requires a rigorous manufacturing process.
Manufacturing Process:
The manufacturing of the FSBB20CH60A IGBT module involves various stages, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. These processes are necessary to ensure the high-quality performance of the module.
Packaging and Testing:
To provide high-quality components, the finished products need to undergo appropriate packaging and testing. The packaging process ensures that the components are adequately protected from any damage that could occur during shipping and installation. The module undergoes various tests to ensure its safety, durability, and performance.
Conclusion:
Overall, the FSBB20CH60A IGBT module is an essential component in many electronic devices. Its compact size, high efficiency, and excellent performance parameters make it a reliable choice for various application scenarios. The mixed-signal integrated circuit and complex manufacturing process make it a technical feat worthy of further academic investigation.
